Hi fellow Ozbargainers,
I just completed (almost) a PC build last night (https://au.pcpartpicker.com/list/H3wDgt) and made a mistake when placing the standard AMD heatsink/fan assembly (Wraith Stealth) on the processor, Ryzen 5 3600.
After placing the Wraith Stealth and tightening the four screws, I couldn't seat the RAM sticks (Micro-ATX) as the AMD logo on top of the fan casing protrudes and sticks out slightly on one side taking extra space and blocking RAM module's headroom on the motherboard (ASRock B550M-HDV). I tried to seat the RAM stick and realized that it would be almost impossible to seat it because of the protruding AMD logo blocking the area just above the RAM module. These RAM sticks also happen to be slightly thicker (G.Skill Ripjaw modules).
So, after about 5 minutes, I removed the heatsink/fan assembly, changed its orientation so the AMD logo points towards the IO Panel and then reseated it. I was then able to seat both the memory modules without any trouble. When I removed the heatsink (after seating it for the first time), I could see the thermal paste was spread over the processor and it looked a little fresh (wet). I simply reseated the heatsink as is after changing its orientation and then tightened the screws to secure it in place again.
Is this (reseating) going to be a problem in terms of CPU cooling/performance? Should I remove the heatsink/fan assembly, apply fresh thermal paste and then re-seat it?
I saw a couple of videos on Youtube before doing Ryzen 5 and B550 builds and unfortunately none of the videos seemed to mention this subtlety; presumably, because they were using standard ATX motherboards and cases as opposed to micro-ATX. I have also tried to search on the Internet but can't seem to find anything for my particular scenario.
Thanks in advance for any guidance.
I don't think it would be an issue but if you are concerned just check your CPU temps when you turn on the computer.